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Recently, exciting news came: the Suzhou Municipal Bureau of Industry and Information Technology announced the proposed recognition list of the 2024 Su-Xi-Chang First Set of Major Equipment. Jiangsu Xinmeng Semiconductor Equipment Co., Ltd.'s fully automatic wafer pod cleaning machine (Model: FC-A300) successfully made the list!

Jiangsu Xinmeng Semiconductor Equipment Co., Ltd.Successfully Selected into theProposed Recognition List of2024 Su-Xi-Chang First Set of Major Equipment

Through years of dedicated research, Jiangsu Xinmeng has successfully developed and launched China's first fully automatic wafer pod cleaning machine, achieving mass production. This recognition as a "Su-Xi-Chang First Set of Major Equipment" is an affirmation of Jiangsu Xinmeng's long-term commitment to technological innovation and industrialization in the field of high-end semiconductor wet process equipment, especially in fully automatic wafer pod cleaning. We will continue to deepen our expertise in advanced semiconductor wet process equipment, pursue continuous innovation, and safeguard national development in the micro-nano field with cutting-edge technologies.

Equipment Introduction

As a critical carrier for storing and transporting wafers in semiconductor manufacturing, the cleanliness of wafer pods directly affects the yield of wafers in advanced processes. Residual micro-contaminants such as particles, molecular pollutants, or metal ions on the wafer pod surface may transfer to the wafer, causing wafer defects and even process failures. Therefore, high-precision cleaning of wafer pods is crucial for ensuring wafer quality and improving production line yield.

The approved fully automatic wafer pod cleaning machine is a high-precision cleaning equipment specifically designed for advanced semiconductor processes. It integrates core functional modules including a cleaning module, vacuum drying module, front-end loading module, and fully automatic robot. Through sophisticated cleaning processes, the equipment efficiently removes micro-nano particles, AMC (Airborne Molecular Contamination), and metal ions from the wafer pod surface, significantly enhancing pod cleanliness and meeting the semiconductor industry's stringent requirements for contamination control.

With Outstanding Cleaning Performance and Stable Process Control Jiangsu Xinmeng's fully automatic wafer pod cleaning machines have been widely adopted by leading domestic semiconductor substrate and integrated circuit (IC) manufacturing enterprises. This achievement not only fills the technological gap in high-end wafer pod cleaning equipment in China but also provides solid support for promoting the high-quality development of the country's semiconductor industry chain.